Design competition / intl. trade fairs

iF Intl. Forum Design GmbH will present the “iF Packaging Award” at interpack (www.interpack.com) Process and Packaging 2008, organized by Messe Düsseldorf North America, April 24-30, 2008 in Düsseldorf, Germany.

Deadline for entry submission is December 15, 2007. Visit www.ifdesign.de for more information.

At Pack Expo Las Vegas 2007, Messe Düsseldorf North America will promote three international trade fairs for the packaging industry: interpack Process and Packaging 2008, Upakovka 2008, and Brasilpack 2008.

Visit www.mdna.com for more details.

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