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Ever-evolving PACK EXPO International reinvents itself again

The biggest event in packaging this year is drawing into its substantial orbit a host of all-new educational tracks, events, and activities to join the established curriculum of tried-and-true programs.

PACK EXPO International
PACK EXPO International

PACK EXPO International 2018 represents the biggest event of the year for the packaging sector, and it’s coming to Chicago’s McCormick Place Oct. 14-17. Healthcare Packaging EXPO is co-located by PACK EXPO producer PMMI, The Association for Packaging and Processing Technologies.

These combined events will bring together 2,500 exhibitors showcasing their packaging innovations to 50,000 attendees in 1.2 million net sq ft of exhibit space.

The big show is always evolving and improving, and 2018 has a host of new highlights, features, and events. One of the most impactful emerging sets of technologies where packaging is concerned has been digital printing. In light of the recent advances in the technology—and the massive opportunity those advances may present to packagers dealing with SKU proliferation and customization—PACK EXPO debuts the PACKage Printing Pavilion.

Digital printing pavilion
Printing industry leaders consider the PACKage Printing Pavilion as the industry’s new main stage for package printing innovations.

“There has been an overwhelming response from exhibitors, and we are excited to provide attendees, in one place, all of the new package printing innovations PACK EXPO International will showcase,” says Laura Thompson, senior director of expositions, PMMI.

A few of the big names showcasing their innovations in the debuting pavilion are:

• HP Inc.

• Kao Collins Inc.

• H.S. Crocker Co, Inc.

• KBA – Kammann USA Inc.

• Afinia Label

With space approaching 90 percent full at press time, this must-see pavilion is positioned to exceed the expectations of digitally charged end-users and OEMs hoping to explore the latest trends in package printing.

SKU proliferation, micro marketing efforts, sustainability, and traceability concerns are driving companies toward digital packaging applications. Meanwhile, more and more suppliers at PACK EXPO International are exhibiting digital products, with an emphasis on smart packaging applications. The PACKage Printing Pavilion brings together these digitally charged end-users and OEMs. The 50,000 square-foot pavilion specifically targeting package printing, located in the South Building at McCormick Place, shines a spotlight on digital printing and converting technologies for short-run, on-demand, cost-effective, variable data and personalized packaging.

A funny thing happened on the way to the Forum
The Forum at PACK EXPO, which earned its stripes and drew rave reviews at the regional level at PACK EXPO East, is being called up to the big leagues in Chicago.

Take advantage of these free, unique, interactive learning sessions during PACK EXPO International. The Forum at PACK EXPO will feature 45-minute open sessions on the latest industry trends by the OpX Leadership Network, World Packaging Organisation, Institute of Packaging Professionals, Contract Packagers Association, and PMMI Business Intelligence. Sessions will be interactive, including hands-on activities, small group discussions, and Q&A sessions.

These sessions, located in North Hall, Booth N-4580, are free to all registered attendees, and will be held on all four days of the show.

Celebrating excellence
The Technology Excellence Awards will debut this year at the show. The awards recognize exhibitors’ innovative technology they have developed that has not been shown at a previous PACK EXPO event.

There was a great response from exhibitors nominating some truly innovative solutions for the awards, and PMMI has enlisted industry professionals to review the submissions and narrow them down to just three finalists in each category.

The Technology Excellence Awards Panelists are:

• Stephanie Neil, Editor-In-Chief, OEM Magazine

• Ronald Puvak, Managing Director, Contract Packaging Association

• Dr. Bruce Welt, Professor (Packaging Engineering) - Department of Agricultural and Biological Engineering, University of Florida

• Carlos Diaz, Associate Professor (Packaging Science) - College of Applied Science & Technology, Rochester Institute of Technology

• Jane Chase, Executive Director, Institute of Packaging Professionals (IoPP)

• Pat Reynolds, VP Editor Emeritus, Packaging World

• Matt Reynolds, Editor, Packaging World

Finalists by category:

General Packaging
• B&R

• Evolabel AB

• PPi Technologies Group

Baking & Snack
• Sun Centre USA

• Bemis Company Inc.

• Triangle Package Machinery Co.

Beverage & Dairy
• R.A. Jones

• LEWA-Nikkiso America Inc.

• Volpak

Meat/Poultry/Seafood
• UltraSource LLC

• Bemis Company Inc.

• INFICON

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