NEW EVENT! Cutting-edge Trends for Every Industry at PACK EXPO Southeast
Discover packaging & processing solutions for all industries at the all-new PACK EXPO Southeast in Atlanta, GA, March 10-12, 2025
LAST CHANCE! Register ASAP for $30

Control Comes to I/O

Turck’s new Field Logic Controller offers a different take on the edge computing concept by bringing simple logic control to Ethernet I/O blocks.

Turck's new Field Logic Controllers
Turck's new Field Logic Controllers

Edge computing is one of the hottest trends being touted in manufacturing today for its ability to distribute intelligence and enable Internet of Things (IoT) applications. By bringing control to the device, rather than housing it in a central location, edge computing’s primary use is in relieving the burden put upon the network by the acquisition and analysis of greater amounts of sensor and device data.

Most edge computing applications involve the placement of microprocessors with significant amounts of computing power on or near the device to be controlled. Top shelf, high availability and fault tolerant computing are typically promoted as key aspects of edge computing.

By stepping back from such advanced applications of edge computing and focusing on simple control applications involving dozens—rather than hundreds—of I/O points, Turck has introduced a new edge computing application with its Field Logic Controller (FLC). With this simpler focus, the FLC has a higher potential for adoption by a large number of manufacturers, as well as a means for those manufacturers to explore edge computing.

Microprocessor advances that led Turck to develop the FLC enable I/O blocks to manage both standard I/O functions and the control responsibilities that were formerly only capable through PLCs. Plus, this combination can be achieved “for a fraction of the cost of PLC computing because less hardware and software is required,” says Randy Durick, vice president of fieldbus technology at Turck. “It also brings control into challenging field environments because the FLC blocks carry advanced IP ratings for ingress protection.”

New e-book on Flexible Packaging
In this e-book, you’ll learn key considerations for vertical and horizontal f/f/s and how to choose between premade bags and an f/f/s system. Plus, discover the pitfalls to avoid on bagging machinery projects.
download
New e-book on Flexible Packaging
INTRODUCING! The Latest Trends for All Industries at PACK EXPO Southeast
The exciting new PACK EXPO Southeast 2025 unites all vertical markets in one dynamic hub, generating more innovative answers to your production challenges. Don’t miss this extraordinary opportunity for your business!
REGISTER FOR $30!
INTRODUCING! The Latest Trends for All Industries at PACK EXPO Southeast