Dow’s 2023/2024 edition of its Packaging Innovation Awards (PIA), now into its 35th edition, will be held in Asia-Pacific this year as the region plays host for the first time to both the judging event and awards ceremony. This marks a milestone for the awards as it continues its purpose of highlighting innovative packaging across industries and geographies.
Nominations are open to packaging designs from all industries and geographies. Entries can be submitted here and deadline to submit is March 8, 2024.
