Discover your next big idea at PACK EXPO Las Vegas
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries. Click to learn more.

PMMI Foundation Honors Six Outstanding Students with $5,000 PACK EXPO Scholarships

The PMMI Foundation awarded six from North American colleges and universities to support their academic pursuits and future careers in the packaging and processing industries.

Pack Expo 2024 Big

The PMMI Foundation, the charitable arm of PMMI, The Association for Packaging and Processing Technologies, proudly announces the recipients of the 2024 PACK EXPO scholarships. This year, six exceptional students from North American colleges and universities have each been awarded a $5,000 scholarship to support their academic pursuits and career development in the packaging and processing industries.

The scholarships, made possible through the PACK gives BACK™ events at PACK EXPO International and PACK EXPO Las Vegas, are part of PMMI’s commitment to investing in the future workforce.

“Supporting the next generation of industry leaders is central to our mission,” says Jim Pittas, president and CEO, PMMI, producer of the PACK EXPO portfolio of trade shows. “Thanks to the incredible support of our sponsors and partners, we can continue to provide resources that inspire innovation and growth in the packaging and processing sectors. We extend our gratitude to everyone who contributes to this initiative.”

Each year, the PMMI Foundation awards over $200,000 in scholarships to students pursuing degrees in fields such as packaging, food processing, engineering, and mechatronics. Since its establishment in 1998, the Foundation has awarded over $3.8 million to strengthen the future workforce, demonstrating its ongoing commitment to fostering industry talent.

To be eligible for the $5,000 scholarship, students must demonstrate academic excellence, major in engineering, packaging, processing, mechatronics, or a related field, and show a strong commitment to advancing the industry.

Congratulations to the 2024 PACK EXPO Scholarship recipients:

  • Morgan Bartholomew, Pennsylvania College of Technology, Polymer & Plastics Engineering
  • Amy Foo, California Polytechnic State University, San Luis Obispo, Industrial Technology and Packaging
  • Matthias Fowler, Hennepin Technical College, Mechatronics
  • Madison Roberts, Michigan State University, Packaging Science
  • Ethan Sawyer, Tennessee Technological University, Mechanical Engineering
  • Blake Strickland, Cape Fear Community College, Industrial Engineering Technology

For more information about the PMMI Foundation and its scholarship programs, visit pmmifoundation.org/scholarships.

Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics
Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
Take me there
Conveying Innovations Report