PMMI Announces Six PACK EXPO Scholarship Winners

Six PACK EXPO Scholarship recipients were recognized yesterday at the annual PACK gives BACK^™ networking reception, sponsored by Rockwell Automation, at PACK EXPO International and co-located Healthcare Packaging EXPO (Oct. 14–17; McCormick Place, Chicago). The PMMI Foundation awards the scholarships annually to six students from PMMI Partner Schools, according to show producer, PMMI, The Association for Packaging and Processing Technologies.

“This scholarship program shows how PMMI invests in the future packaging workforce,” says Jim Pittas, president and CEO, PMMI. “PACK gives BACK is an attendee favorite year after year, and we’re proud to support the education of next generation’s industry leaders.”