Discover your next big idea at PACK EXPO Las Vegas
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries. Click to learn more.

Papier Sprick to Demonstrate the SpeedMan™ Basic at PACK EXPO International 2024

See Papier Sprick's compact electric entry system on display in Booth N-5164!

Speed Man Basic Papier Sprick 04

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

Speed Man Basic Papier Sprick 03Papier Sprick unveils the SpeedMan™ Basic, an entry-level void fill system for automating the packaging process.

It is designed for ease of use and uninterrupted workflow, thanks to its plug-and-play setup and no paper jams.

A compact design and various frame options allow for easy and ergonomic integration into your packaging station. The eco-friendly consumables made from recycled paper enable a sustainable packaging process. 

Experience the Papier Sprick SpeedMan™ Basic system live at PACK EXPO International in Booth N-5164 in Chicago, Nov. 3-6, 2024.

Fill out the form below to request more information about Papier Sprick to Demonstrate the SpeedMan™ Basic at PACK EXPO International 2024
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
Download Now
Annual Outlook Report: Workforce
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics