Papier Sprick to Demonstrate the SpeedMan™ Basic at PACK EXPO International 2024

See Papier Sprick's compact electric entry system on display in Booth N-5164!

Aug 5, 2024

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Papier Sprick unveils the SpeedMan™ Basic, an entry-level void fill system for automating the packaging process.

It is designed for ease of use and uninterrupted workflow, thanks to its plug-and-play setup and no paper jams.

A compact design and various frame options allow for easy and ergonomic integration into your packaging station. The eco-friendly consumables made from recycled paper enable a sustainable packaging process.

Experience the Papier Sprick SpeedMan™ Basic system live at PACK EXPO International in Booth N-5164 in Chicago, Nov. 3-6, 2024.

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