NEW EVENT! Cutting-edge Trends for Every Industry at PACK EXPO Southeast
Discover packaging & processing solutions for all industries at the all-new PACK EXPO Southeast in Atlanta, GA, March 10-12, 2025

Condition Monitoring Sensor

Balluff’s condition monitoring sensor can measure vibration, temperature, relative humidity, and ambient pressure. It collects and processes these readings and outputs digital statistical data to a host system via IO-Link.

Condition Monitoring Sensor

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

In addition, the sensor can detect and communicate its condition, continuously reporting its temperature, number of operating hours, and start cycles. By automating cost-intensive manual inspections, it minimizes unscheduled stops and faults in the production process. This condition data is an essential component for implementing smart and flexible manufacturing.

Balluff's sensor is available in two versions, both in an extremely small stainless-steel form factor. The first measures contact temperature and vibration in all three axes of motion and has  IP67 and IP69K ratings making it especially useful for harsh environments. The other adds the additional environmental variables of relative humidity and ambient pressure and delivers an IP67 rating. 

The sensor’s standardized IO-Link protocol allows users to easily parameterize the sensors and match the processing in the sensors to their specific application. The process data structure permits users to configure five measured or preprocessed data types to be cyclically transmitted. It is also possible to perform an acyclical request for additional statistical processing variables. 

Key features:
Multiple measurements in one device: vibration, temperature, relative humidity, ambient pressure

Integrated processing circuitry with configurable data preprocessing

Configurable events and status indicators

Fast connection and simple to incorporate using IO-Link

Extremely compact form factor for restricted spaces


Fill out the form below to request more information about Condition Monitoring Sensor
New e-book on Flexible Packaging
In this e-book, you’ll learn key considerations for vertical and horizontal f/f/s and how to choose between premade bags and an f/f/s system. Plus, discover the pitfalls to avoid on bagging machinery projects.
download
New e-book on Flexible Packaging
INTRODUCING! The Latest Trends for All Industries at PACK EXPO Southeast
The exciting new PACK EXPO Southeast 2025 unites all vertical markets in one dynamic hub, generating more innovative answers to your production challenges. Don’t miss this extraordinary opportunity for your business!
Read More
INTRODUCING! The Latest Trends for All Industries at PACK EXPO Southeast