Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

INX International Ink Co.: All-in-one package design tool

INX's Color-Chain Workflow™ Suite combines advanced technologies to increase package design and production speed, color accuracy, quality and efficiency.

Available as a fully integrated Suite or in a la carte versions, Color-Chain Workflow™ tools include Visualizer software by ESKO Artwork. Designers can create on-screen 3D mockups of package and label designs. Packages can be viewed in different venues such as store shelves or the home. Also included in the Suite is The Beyond Stochastic — Concentric Screening which provides an even more photo-like look than FM, and more detail than AM. It can also result in ink savings of 10% - 30%. The Suite’sThe Super R-SKAT — Computer Color Matching software developed by Sakata INX provides user-friendly process control software for use in the pressroom that enables inexperienced operators to match colors precisely and ensure consistent color accuracy. Another tool, the TCM Program with CP3NAVI helps lock-in quality and consistency. And the Media Beacon Digital Asset Management system, used with Auto typesetting Software developed by Baby-Universe, enables digital data and usage to be centralized and shared .
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Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers