Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Tsubaki: Backstops

Tsubaki launched BS-F external backstops. The improved labyrinth seal design extends the life of the product by minimizing the ingress of dust and contaminants. Backstops are designed with the smallest envelope dimensions available in the market, which is said to ensure quick and easy field installation when replacing other backstops.

BS-F external backstop
BS-F external backstop
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing