Balluff: RFID processors combine low and high frequency in one device

Using a new generation of RFID processors, the Balluff BIS V RFID system maximizes flexibility by providing a single device for both low frequency 125 KHz and high frequency 13.56 MHz read/write heads with an IO-Link master port.

Pw 44458 Balluff Bisv 300dpi

Combining up to four head capability on both frequencies with local analog, valve manifold or I/O access/control provides a solution for many types of RFID applications.  Time and money are saved using a single processor platform across the application installation base. The BIS V system also allows users to draw on a single processor family with a wide array of read/write head and RFID tag options for both manufacturing and logistics solutions.

The BIS V processor provides a functional display and LED¹s making status and setup easy.  A USB service interface makes connection for setup to PCs simple. The BIS V offers these additional functions: four asynchronous 125 KHz and 13.56 MHz read/write antenna channels; LCD display with control buttons for setting and displaying the network address and data carrier/tags UID; an integrated IO-Link master port for connecting discrete or analog I/O, or valve manifolds; industrial IP 65 rated metal housing; intelligent power plug option for saving parameters on the device; flexible mounting options for hard-point or DIN rail.


 

Conveying Innovations Report
Editors report on distinguishing characteristics that define each new product and collected video demonstrating the equipment or materials as displayed at the show. This topical report, winnowed from nearly 300 PACK EXPO collective booth visits, represents a categorized, organized account of individual items that were selected based on whether they were deemed to be both new, and truly innovative, based on decades of combined editorial experience in experiencing and evaluating PACK EXPO products.
Take me there
Conveying Innovations Report
2024 PACK EXPO Innovations Reports
Exclusive access: Packaging World editor-curated reports revealing PACK EXPO's most groundbreaking technologies across food, healthcare, and machinery sectors. Each report features truly innovative solutions selected from hundreds of exhibitors by our expert team. Transform your operations with just one click.
Access Now
2024 PACK EXPO Innovations Reports