Discover What’s Possible in Packaging & Processing, Oct. 18-21 in Chicago
See solutions from 2,600 exhibitors and gain insights from 150+ free educational sessions at North America’s largest packaging & processing event.
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B&R Industrial Automation: Thin-panel PC

The Provit 5600 industrial PC from B&R Indus-trial Automation (Roswell, GA) combines a sealed front panel designed for tough NEMA 4-type environments with the convenience of front access to CD-ROM and floppy disk drives.

Pw 20511 The Pro560ind 35

Front panel is only 11/4" deep and is detachable, allowing remote mounting on the machine with the actual PC remaining safely in a central control cabinet.

Is your packaging line built for connected packaging?
RFID, QR codes, and 2D barcodes are reshaping CPG operations. See how leading brands are adapting.
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Is your packaging line built for connected packaging?
Discover How to Stay Ahead of the Competition at PACK EXPO International
See new solutions from 2,600 exhibitors. Gain insights from 150+ free educational sessions. From automation & robotics to real-time data insights, find the tech for your company’s future at North America’s largest packaging & processing event.
REGISTER NOW & SAVE
Discover How to Stay Ahead of the Competition at PACK EXPO International