Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.

National Instruments: Compact FieldPoint devices

National Instruments has introduced 2 new Compact FieldPoint devices that allow for a reduced number of required modules and a significantly reduced system jitter.

The NI cFP/FP-DIO-550 is a 16-channel digital input/digital output module that measures 8 digital inputs with a range of 11 to 30 VDC and sources 8 outputs from 10 to 30 VDC with 250 mA per channel. The cFP-AI-118 is an 8-channel analog input module that measures 8 analog inputs at 16-bit resolution and offers a 10 kS/s per channel sampling rate with a range of 0 to 1, 5, 10, or 15 V, and +/-1, +/-5, +/-10, +/-15 V. In addition, the module’s architecture offers a dual port memory module, significantly reducing system jitter. Both devices are suitable for industrial control applications requiring multiple types of inputs and outputs in 1 bank, or where high-voltage channel-to-channel isolation is essential due to ground loops and similar conditions that could damage control equipment.

Pharmaceutical Innovations Report
Discover the latest breakthrough packaging technologies shaping the pharmaceutical sector. This report dives into cutting-edge innovations, from smart containers that enhance patient safety to eco-friendly materials poised to transform the industry’s sustainability practices. All from PACK EXPO. Learn how forward-thinking strategies are driving efficiency and redefining what’s possible in pharma packaging.
Learn More
Pharmaceutical Innovations Report
2024 PACK EXPO Innovations Reports
Exclusive access: Packaging World editor-curated reports revealing PACK EXPO's most groundbreaking technologies across food, healthcare, and machinery sectors. Each report features truly innovative solutions selected from hundreds of exhibitors by our expert team. Transform your operations with just one click.
Access Now
2024 PACK EXPO Innovations Reports