Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

National Instruments: PCI-based digitizer

National Instruments announces the NI PCI-5124, a PCI version of its 12-bit, 200 MS/s PXI-based digitizer. The NI PXI-5124 and NI PCI-5124 digitizers deliver more than 75 dBc spurious-free dynamic range (SFDR) on two simultaneously sampled inputs with 150 MHz bandwidth.

Pw 11643 Nat Insdigitizer

Both devices are based on the NI Synchronization and Memory Core (SMC) architecture, which features up to 512 MB of onboard memory per channel, fast data transfer, and tight synchronization. Design and test engineers can synchronize SMC-based modular instruments within tens of picoseconds for high-channel-count and mixed-signal applications.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing