Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Wago Corporation: Smallest I/O-IPC

The WAGO-I/O-IPC 758 Series Industrial PC from Wago Corp. integrates all standard PC functions including network and fieldbus interfaces. The 266 MHz Pentium-processor-powered unit with Linux or Microsoft Windows-based operating system permits decentralized control, subnetworking with popular fieldbuses, as well as recording, analyzing, and measuring data.

Pw 13353 Wago
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers