Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging & processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Beckhoff Automation: Beckhoff Automation: Integrated valve manifold

The Festo CPV IP65 valve manifold is now available as an extension module on Beckhoff USA’s popular IP67 fieldbus box I/O system. Connection with a noise-immune fiber-optic cable allows the CPV Manifold to be mixed with the wide range of the company’s network couplers and I/O.

Pw 13947 Beckhoff

The integrated design reduces network node consumption, cabling and space due to the compact size of both units.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
Special Report: Track & Trace
Discover new tools to approach the supply chain that allow you to leverage your data, see real-time visibility, and forecast future sales. You’ll also learn about KH Hive, an in-house digital demand planning tool that Kraft Heinz created to help the company realize its goals, forecasting sales expectation down to the SKU level, location level, and daily level.
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Special Report: Track & Trace