Discover your next big idea at PACK EXPO Las Vegas
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries. Click to learn more.

Wireless IO-Link Master For Remote Motion Control

SMC’s next-gen wireless base module gets reduced in size and adds flexible connectivity capabilities.

SMC
SMC

SMC showcased a sample of the next generation of its traditional wireless base modules during PACK EXPO 2019. The next iteration of the wireless base takes up 50% less space and has a remote antenna that can be mounted onto a control panel. This antenna has an IP66 washdown rating so it can be exposed to harsh conditions.

 

While this is just a concept for SMC, the company expects this technology to be available for purchase within the next four to six months.

Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—Packaging World editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
Download Now
Annual Outlook Report: Sustainability
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics