The booth will include demonstrations from six different companies highlighting the ease of integrating the various packaging line functions (control, HMI, MES) when utilizing the Connect-and-Pack™ standards. The OPW Booth will be located in the Grand Concourse area of McCormick Place (Booth C-65) in Chicago, IL, November 9-13, 2008.
The Connect-and-Pack standards of PackML and PackTags were recently approved as part of the ISA88 standards. Connect-and-Pack standards make packaging operations more effective by simplifying customization and integration, which enables world class packaging operations. When implemented, packaging companies and their partners gain a competitive advantage as they leverage an integrated supply chain to optimize operations.
The companies participating with demonstration units utilizing the Connect-and-Pack standards in the OPW Booth include B&R Automation, Elau, GE Fanuc, Rockwell Automation, Wago, and Wonderware. Each HMI and MES function in the demonstrations will be able to communicate with every controller function in the demonstrations using the PackTags specification—part of the OPW Connect-and-Pack standards. All of the Pack- Tags communication will be done over Ethernet using OPC. Some of the functions implemented in this integrated demonstration include controlling the machine states and modes, tracking production and reliability (including OEE), and alarm monitoring.
The recently approved ISA88 Technical Report on Machine and Unit States documenting how PackML and PackTags follow the ISA88 standard is available on the ISA standards website (www.isa.org/standards).
For more information on OPW’s Pack Expo International 2008 booth demonstration, visit www.omac.org/packexpo2008.
