Explore PACK EXPO insights here
Discover a taste of the PACK EXPO highlights, live from the show floor!

What is MEMS?

This is a sidebar to the main story "Kodak rocks the packaging boat" which appears in the March 2008 issue of Packaging World Magazine, p. 48

MEMS is an acronym for Micro-Electro-Mechanical Systems. It’s the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. Some observers predict that MEMS will revolutionize nearly every product category by bringing together silicon-based microelectronics with micromachining technology.

Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—Packaging World editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
Download Now
Annual Outlook Report: Sustainability
Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this month to experience a breakthrough in packaging and processing.
REGISTER NOW
Break out of the ordinary: see what’s new in packaging & processing!