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Pack Expo-Las Vegas spotlights co-packers and 'The Brand Zone'

Pw 5050 Pack Expo Logo Cp

Visitors to this year’s Pack Expo-Las Vegas (www.packexpo.com) will have access to a variety of exhibitors and speakers to update themselves on developments affecting the contract packaging industry. The trade show will be Oct. 5-7, 2009, at the Las Vegas Convention Center, Las Vegas, NV. The show sponsor and producer is the Packaging Machinery Manufacturers Institute (www.pmmi.org).

Pack Expo will feature more than 1,200 exhibitors, including dozens of contract packaging service providers.

Besides the exhibit floor, Pack Expo will feature a conference. One spotlight will be developments in private-label products, a key area of interest in contract packaging. Among the speakers will be the following two keynoters:

• Doug Palmer, vice president, Own Brands, at the Atlantic & Pacific Tea Co., will discuss the future of private-label packaging and branding.
• Mike Witynski, group vice president, Our Own Brands, at Supervalu, will challenge packaging suppliers, contract packagers, and designers to bring innovative technologies and concepts to the burgeoning private-label sector.

In addition, Pack Expo will offer the following areas of interest:


• A new area, called The Brand Zone, will occupy more than 60,000 sq ft of space. The intent is to help brand owners maximize their success on shelf. The Brand Zone will spotlight packaging technologies that can help “open innovation” executives, brand managers, marketers, and package designers launch new products, refresh existing brands, and improve sustainability scores.
• Two shows, Process Expo and CPP (Converting & Package Printing) Expo, will be co-located with Pack Expo. Process Expo will present new developments in processing technology to meet the challenges faced by the industry’s food and beverage manufacturers. CPP Expo is designed to reflect the new market synergies of the package printing, converting, finishing machinery, and supplies industries.

Visit www.packexpo.com.

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