Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Detecting Leaks in MAP Food Packages

The Contura S400 Leak Detector offers a unique solution for detecting leaks in MAP (modified atmosphere packaging) and other flexible packages.

Whether it is a gross leak or a fine leak that it is undetectable by the naked eye or by the water bath method, the unique technology of the Inficon Contura S400 Leak Detector can detect any leak without tracer gas and without damage to the package. Inficon featured the Contura S400 at PACK EXPO Connects.

PACK EXPO Connects – November 9-13. Now more than ever, packaging and processing professionals need solutions for a rapidly changing world, and the power of the PACK EXPO brand delivers the decision makers you need to reach. Attendee registration is open now.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing