Discover your next big idea at PACK EXPO Las Vegas
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries. Click to learn more.

Inaugural Chuck Yuska Scholarship awarded

PMMI grant honors former president and CEO

PMMI grant honors former president and CEO
PMMI grant honors former president and CEO

PMMI, The Association for Packaging and Processing Technologies, is pleased to announce Laura Kershaw, a senior Packaging Engineering student at Rutgers University as the recipient of the inaugural Chuck Yuska Scholarship. The scholarship was established in honor of Chuck Yuska, PMMI’s former president and CEO of 28 years, who was an influential force in growing PMMI and the association’s PACK EXPO portfolio of trade shows.

To qualify for the $5,000 scholarship, students must be studying engineering, packaging, processing, mechatronics or a related field at a PMMI Education Partner school.

“PMMI is proud to invest in the future of the packaging and processing industry, in honor of Chuck Yuska,” says Jim Pittas, president and CEO, PMMI. “Chuck has and continues to be a mentor for so many, and now this scholarship in his name continues to inspire others to get involved with our industry.”

Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this month to experience a breakthrough in packaging and processing.
REGISTER NOW
Break out of the ordinary: see what’s new in packaging & processing!
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics