Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

scanware electronic GmbH: Inspection systems

Lynx-Capa CI and Lynx-Spectra 3D provide speedy inspection of packaging materials and products.

Lynx-Capa CI and Lynx-Spectra 3D provide speedy inspection of packaging materials and products.
Lynx-Capa CI and Lynx-Spectra 3D provide speedy inspection of packaging materials and products.

scanware electronic GmbH offers the high-resolution case inspection system Lynx-Capa CI to prevent counterfeiting. The system inspects a variety of prints, such as those on bundles and shipper cases. The use of a high-end CPU guarantees rapid evaluation of data. Packaging units like bundles, cases, and pallets are equipped with an identification label and verified by scanning. The data is then transmitted to the database and aggregated if necessary.

Lynx-Spectra 3D is a high-resolution, laser-based image processing system for the inspection of packaging material and products to detect distortions, dents, and other defects. The geometry of the inspected object is illuminated by a laser. The resulting image is captured by a high-resolution 3D line camera, and the image is processed, digitalized, and evaluated. Areas of application include tablets, oblongs, hard- and soft-gel capsules, dry powder, aluminum blisters, PVC blisters after filling, and multi-layered tablets.

Fill out the form below to request more information about scanware electronic GmbH: Inspection systems
Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
REGISTER NOW AND SAVE
Break out of the ordinary: see what’s new in packaging & processing!
Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report