Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

TURCK, Inc: Interface modules

To simplify device set-up and installation time, Turck’s interface modules (IM) can be programmed via a PC or on-board push buttons using FDT/DTM software, along with PACTware.

Pw 5148 Webturck
This software allows multiple parameters to be set and saved in seconds. Facilitates asset management with trending and data logging of values in a variety of applications. IM models monitor motor speed, shaft speed and conveyors, as well as the temperature of RTDs and thermocouples. They can control or monitor analog signals for linear movement, temperature, pressure, level control or any other device using 4 to 20 mA signals. Intrinsically safe IM models are also available to control devices in hazardous areas.

Fill out the form below to request more information about TURCK, Inc: Interface modules
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics