See new packaging innovations in one convenient place at PACK EXPO East
Get up to speed on the latest innovations in packaging and processing at PACK EXPO East, March 18 – 20 in Philadelphia. Don’t miss out!

Machine modularity means faster delivery, lower cost, and greater flexibility for integrated lines

Whether the need is to automate product handling to feed a single machine, or to automate a complete primary and secondary packaging line, Bosh delivers an optimum solution with its Module++ concept.

Module++ describes our competence to integrate standard, modular machines into an automated line with options specific to your application.  Integration requirements are considered early in the project phase to ensure compatibility and the use of standard machines reduces engineering for your automation project. This results in shorter delivery times and considerably lower investment cost than completely customized solutions.  Typically the engineering expense involved in Module++ solutions is less than 3% of the order.  Furthermore, you obtain your complete solution from one source.  Our broad machine portfolio is unrivaled and as necessary, Bosch will also incorporate additional machines from outside companies to help you manage the overall project.  This means lower coordination and project costs for you.   

 

More information, specs, and photos
Discover Our Content Hub
Access Packaging World's free educational content library!
Read More
Discover Our Content Hub
Discover innovations from 400+ packaging & processing suppliers.
The largest PACK EXPO East in history is March 18-20 in Philadelphia! In one convenient location, you’ll discover new technology from top suppliers, get quality problem-solving time with experts and learn the latest trends in free educational sessions.
Read More
Discover innovations from 400+ packaging & processing suppliers.