Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

Balluff: Compact sensor

The Balluff BMF 273 is a compact sensor specifically for use with C-slot-equipped pneumatic cylinders.

Pw 7047 C Balluff
Designed to indicate piston stroke end position, the sensor is just 25.7 mm L and fits completely within a standard C-slot. The BMF 273 is secured by a nonstripping screw, while the cable is also equipped to be secured within the C-slot by a custom-designed mini pop-in fastener. The highly accurate, low-hysteresis sensor comes with an LED indicator light and uses advanced magnetoresistive technology.

Phone: 800/543-8390 | www.balluff.com

Fill out the form below to request more information about Balluff: Compact sensor
Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
REGISTER NOW AND SAVE
Break out of the ordinary: see what’s new in packaging & processing!
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO