Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

Bosch Rexroth Corp.: Inline I/O system

Rexroth’s Inline I/O system is now available with a SERCOS interface to provide single-bus architecture for your entire control system. This single-bus structure provides a cost-effective, open motion/logic solution for automated machines, without compromising machine speed or flexibility.

Pw 10893 Pa Ctrl Bosch Rex I Osys

Offers a range of digital and analog I/O modules, including block I/O, as well as supply units for connected sensors/actuators. Expansion modules are available to provide additional functionality including counter modules and RTD modules. Other interfaces besides SERCOS also available.

2024 PACK EXPO Innovations Reports
Exclusive access: Packaging World editor-curated reports revealing PACK EXPO's most groundbreaking technologies across food, healthcare, and machinery sectors. Each report features truly innovative solutions selected from hundreds of exhibitors by our expert team. Transform your operations with just one click.
Access Now
2024 PACK EXPO Innovations Reports
Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
Download Now
Annual Outlook Report: Workforce