Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

B&R Industrial Automation: Panel PC

B&R’s Panel PC 800 covers a performance range from energy efficient Intel® Atom™ N270 processors to Core2™ Duo processors for applications with high performance requirements.

Pw 3607 Webbr
The PPC800 with Intel® Atom™ N270 1.6 GHz is designed for cost optimization. Provides up to 3 GB SDRAM for fast processing of memory intensive programs. Dual Core processors are used for high-demand applications. Technologies ranging from Core2™ Duo CPUs to Core2™ Duo T9400 2.53 GHz processors with the new GM45 chipset are available. 15 in. XGA and 19 in. SXGA touch screen displays. Fanless operation. Various options available.
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.