Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Telesis Technologies, Inc: Laser marking system

The Telesis EVC Laser from Telesis Technologies marks “on-the-fly” at high speeds without burn thru on delicate foils and with contrast on various plastics, as well as fast marking on chip boards, plastic bottles, and other materials without consumables or ecology issues.

Pw 37997 Ev40 Headshot Hirez

The small-footprint system allows VANADATE laser technology to enter the “Green Space” required by the latest packaging mandates. Features a Q-switched Nd: YVO4 end-pumped laser design with a remote fiber-coupled diode pump source. Operates where shock, vibration, and dust are a concern.  Features deep focal tolerance, high-quality small beam diameter, air cooled-no chiller required, stable output power.  Integrated PC with touch screen interface, Merlin LS AMI “scan and go” software, quick-posts, and encoder controls are also available.

Fill out the form below to request more information about Telesis Technologies, Inc: Laser marking system
Researched List: Engineering Services Firms
Looking for engineering services? Our curated list features 100+ companies specializing in civil, process, structural, and electrical engineering. Many also offer construction, design, and architecture services. Download to access company names, markets served, key services, contact information, and more!
Download Now
Researched List: Engineering Services Firms
List: Digitalization Companies From PACK EXPO
Looking for CPG-focused digital transformation solutions? Download our editor-curated list from PACK EXPO featuring top companies offering warehouse management, ERP, digital twin, and MES software with supply chain visibility and analytics capabilities—all tailored specifically for CPG operations.
Download Now
List: Digitalization Companies From PACK EXPO