Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

TURCK, Inc: Modular RFID, built-in I/O

Turck introduces BLident, the world’s first modular RFID system with built-in I/O capability.

With BLident, users may add I/O modules to the RFID system—up to 8 channels of RFID on a single gateway—plus additional discrete or analog I/O occupy a single node on the network. Built on the ISO15693 13.56MHz HF standard for an open system, BLident can be integrated into existing platforms, and it supports Profibus-DP, DeviceNet, Modbus-TCP, Profinet, and EtherNet/ IP.

Phone: 800/544-7769

www.turck.com

 

Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report
Pharmaceutical Innovations Report
Discover the latest breakthrough packaging technologies shaping the pharmaceutical sector. This report dives into cutting-edge innovations, from smart containers that enhance patient safety to eco-friendly materials poised to transform the industry’s sustainability practices. All from PACK EXPO. Learn how forward-thinking strategies are driving efficiency and redefining what’s possible in pharma packaging.
Learn More
Pharmaceutical Innovations Report