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Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

HP puts packaging parts on fast track

A rapid prototyping process for developing EPS foam end caps helps Hewlett-Packard meet ongoing new model introductions for its popular DeskJet printers. Moving from initial CAD drawing to final molded parts can be done in four days.

Athree-dimensional solid-body CAD model of an end cap is created by mathematically reversing out the geometry of the CAD model
Athree-dimensional solid-body CAD model of an end cap is created by mathematically reversing out the geometry of the CAD model
Conveyor setup secrets from top CPG manufacturers
7 proven steps to eliminate downtime and boost packaging line efficiency. Free expert playbook reveals maintenance, sequencing, and handling strategies.
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Conveyor setup secrets from top CPG manufacturers
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
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Get a jump on your 2026 packaging & processing goals at PACK EXPO East.