Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

TURCK, Inc: Single Segment Redundant Backplane for FOUNDATION™ Fieldbus H1 segments

TURCK Inc. expanded its Diagnostic Power Conditioner (DPC) system with a Single Segment Redundant Backplane that can combine two isolated power supply modules into one FOUNDATION™ fieldbus segment.

Pw 4289 Turck Web

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

TURCK's new backplane includes an integrated diagnostic unit used to monitor the redundancy of the external bulk power supply along with the H1 power supply--aiding in the availability of the H1 segment. System status is available via a relay contact.

The backplane’s small footprint (113mm high by 42mm wide by 210mm long) is designed for DIN rail mounting, and features separate connections for grounding and shielding. The cable shield may be connected via shield clamps or screw terminals. Three-pole screw terminals with flange connections are also available to connect the segment outputs.

Fill out the form below to request more information about TURCK, Inc: Single Segment Redundant Backplane for FOUNDATION™ Fieldbus H1 segments
Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—<i>Packaging World</i> editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
Download Now
Annual Outlook Report: Sustainability
Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report