Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

News from Tokyo Pack: World’s first recloseable blister pack

Developed by Blisspack Co. Ltd., this blister pack involves a proprietary easy-cut technology using special knives to create a small tear strip in the lidding material near the top of the container. Once this strip has been torn, the package contents can be dispensed. Then, thanks to the intricate yet user-friendly design of the container, the top of the package can be folded so tightly that no product can escape.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers