Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Thermal-transfer ribbon

Sony Chemical (Mt. Pleasant, PA) has introduced a thermal-transfer ribbon designed specifically for printers with near-edge or corner-edge printheads.

Pw 24363 Son Che Mt Ple 24

TR4500 has a wax/resin ink formula that provides clear images and crisp bar codes. Compatible with a wide range of materials, including coated and uncoated paper, paper labels, PP, PE, PS, Tyvek® and polyolefins.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers