Discover your next big idea at PACK EXPO Las Vegas this September
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries.
REGISTER NOW & SAVE

Colordyne’s Open House Focuses on Hybrid Printing Technology

Colordyne Technologies welcomed visitors to its new Inkjet Innovation Center at its corporate headquarters in Brookfield, Wis.

Taylor Buckthorpe presents at Colordyne’s open house.
Taylor Buckthorpe presents at Colordyne’s open house.

This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style.

The open house focused on the benefits of adding digital capabilities to print production for narrow web labels and packaging businesses.

The event featured presentations from industry experts including our partners Kao Collins, Xitron, Avery Dennison, as well as and Colordyne Technologies’ experts. Attendees saw live product demonstrations of Colordyne’s 3800 Series process color retrofits, the UV-LED print engine and its latest eco-friendly water-based development.

"Our goal for this event was to show customers how Colordyne’s inkjet print engines can allow them to gain a competitive edge," said Taylor Buckthorpe, Director of Sales & Marketing at Colordyne Technologies. "Attendees experienced the versatility of our inkjet technology and how working with Colordyne can help fast track its adoption. We thank all of our partners and attendees for making this a successful event".

During the open house, Buckthorpe spoke about the benefits of digital printing and the reliable print-to-die-cut capabilities of Colordyne's inkjet retrofits.


Fill out the form below to request more information about Colordyne’s Open House Focuses on Hybrid Printing Technology
Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
REGISTER NOW AND SAVE
Break out of the ordinary: see what’s new in packaging & processing!
Coding, Marking, and Labeling Innovations Report
Explore our editor-curated report featuring cutting-edge coding, labeling, and RFID innovations from PACK EXPO 2024. Discover high-speed digital printing, sustainable label materials, automated labeling systems, and advanced traceability solutions that are transforming packaging operations across industries.
Access Report
Coding, Marking, and Labeling Innovations Report