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High-speed simulation

A white paper from Systems Modeling Corp. (Sewickley, PA) introduces simulation and discusses how it can help solve common packaging line integration problems.

Examples include identifying bottlenecks; solving low efficiencies; determining whether to install accumulators; knowing how best to position sensors; and determining how best to staff a line. Demonstrates some common approaches to modeling high-speed packaging applications.

Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
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Annual Outlook Report: Workforce
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
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Get a jump on your 2026 packaging & processing goals at PACK EXPO East.