Attend PACK EXPO – this year’s can’t-miss event in Chicago, Oct 23-26.
Discover solutions from 2,000+ exhibitors to advance your operations and network with colleagues at PACK EXPO International.
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Ultrafast automation with reACTION technology

At PACK EXPO, B&R will offer high speed reACTION I/O technology capable of responding to inputs as fast as 1 µs – ideal for firing glue guns, fast and accurate detection/rejection on high speed wrapping and bottling lines, coding on the fly, and precise filling, capping and labeling applications. Visit B&R at booth # 6141 in the North hall at PACK EXPO.

Where the Entire Industry Meets
Discover solutions from 2,000+ exhibitors to advance your operations and network with colleagues at PACK EXPO International, Oct 23-26.
REGISTER TODAY
Where the Entire Industry Meets
The top conveying tips
Read best practices to ensure efficient product handling.
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The top conveying tips