Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Pro Mach’s Labeling & Coding Group Provides Complete Identification Solutions for Products

With solutions for labeling, coding, and marking both primary and secondary packaging, Pro Mach’s Labeling & Coding Group features 23 solutions at Pack Expo. New ID Technology products include a high-speed wipe-on module for printing and labeling, a PackML compliant label printer applicator, and an HDP laser for cutting, scoring, slitting, and marking flexible plastics, films, and foils.

August 28, 2015 - Press Release

Radical New Wipe-On Module for Label Printer Applicators

ID Technology announces the release of their new “Patent Pending” Wipe-On module for the Model 250 and Model 252 Label Printer Applicators.

September 2, 2015 - Press Release

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
Read More
Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
Read More
New e-book on Multipacking and Case Packing