Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 ā€“ 6 in Chicago.

ID Technology Enhances Model 252, the #1 Selling Label Printer Applicator

ID Technology introduces two new application modules for its Model 252 Label Printer Applicator. The high speed wipe application module is designed to wipe a label directly onto the side of a case or carton as the product passes the label printer applicator. The second module is an update to the standard tamp module.

ID Technology, powered by Pro Mach, a leading provider of labeling, coding and marking solutions, has designed an Integrated System featuring a Model 252 Label Printer Applicator and a BEL Case Taper. This system ā€“ the Model 252CTL ā€“ accomplishes taping and labeling of a case in only 7 feet. The system easily accommodates a wide range of box widths as the taper and labeler move simultaneously from one adjustment point. An additional adjustment allows for various height boxes. There is no need for an additional conveyor section to transfer the box from the taper to the labeler. The result is a case taper labeler with an extremely small footprint.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing