Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Pack Expo 2012: Networking and connectivity from Siemens

Sinamics drive system, PLC, IO and HMI offer complete connectivity--ethernet-based Profinet, Profibus, Canbus, Modbus, Ethernet IP, etc. Drive, HMI and I.O. network is not a special configuration, but a selection embedded in the system all ready to work. Delivers seamless, peaceful coexistence of multiple networks over the same wire.

Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers
New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing