New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

Oracle Packaging: High-Barrier Pouchstock

Tailored to the specific challenges of OTC effervescent products, this flexible pouchstock laminate yields hot tack and hermetic seals at low temperatures.

Pw 243442 M Oracle

Oracle Packaging, a provider of flexible packaging solutions for the healthcare, consumer, tobacco, and industrial sectors, offers high-barrier pouchstock laminate tailored to the specific challenges of OTC effervescent products. Ideal for packaging coarse, often powdery effervescent tablets, the flexible packaging solution provides excellent protection against moisture and oxygen for a variety of product formats, shapes and sizes.

A durable sealant layer used in the laminate provides excellent hot tack and hermetic seals at relatively low seal temperatures—important when packaging products that tend to create powdery residue. The pouching materials are comprised of layers of either ink or lacquer, and paper/pe/aluminum foil/sealant.

Offering high levels of puncture resistance, machinability and seal integrity, Oracle Packaging’s effervescent tablet laminates are available in 10 colors in both printed and unprinted rolls. Available in low- or high-gloss materials, the pouchstock can be printed on both sides.

"Oracle Packaging has extensive experience with developing and manufacturing flexible packaging solutions for effervescent products,” says Andrew Starr, Director of Oracle Packaging. Our specifications are built to address the unique needs of these products: specifically shape, fragility, and moisture sensitivity. You can rest assured that Oracle has a product that meets your needs."

Fill out the form below to request more information about Oracle Packaging: High-Barrier Pouchstock
New ebook focused on cartoning equipment
Read about the various types of cartoning equipment, how to select the right one, and common pitfalls to avoid. Plus, read equipment advice from CPGs for ultimate cartoning success.
Read More
New ebook focused on cartoning equipment
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?