New Tool: ProSource
Check out our packaging and processing solutions finder, ProSource.

DuPont Packaging Graphics and Aerospace Huayang sign strategic alliance

DuPont Packaging Graphics recently signed a Memorandum of Agreement (MOA) with Xi’an Aerospace Huayang Printing and Packaging Machinery Co. Ltd., aimed at promoting flexography in the printing and packaging market in China.

Under the terms of the MOA, both parties agreed to work toward increasing the penetration of flexography in China’s packaging and printing market, participating in joint marketing activities to promote the advantages and innovation of Flexographic packaging printing.

“DuPont believes in establishing strong local relationships to help our strategic partners expand their presence in local markets,” said Jagdish Kumar, regional business director, DuPont Packaging Graphics.  “The signing of this agreement between DuPont Packaging Graphics and Huayang is an important milestone as we continue to grow with the market through building and developing key collaborations in China and throughout Asia Pacific.”
Su Xiangyu, general manager, Aerospace Huayang, highlighted the importance of this strategic alliance in his speech during the signing ceremony at the DuPont Packaging Graphics Customer Technology Center in Shanghai.

“The enhanced collaboration between Aerospace Huayang and DuPont definitely enhances our capability to supply customers with quality products that satisfy customers’ needs for higher productivity and environmentally superior products,” said Xiangyu. “Working together, we can more successfully contribute to China’s printed packaging market.”

 

New ebook focused on cartoning equipment
Read about the various types of cartoning equipment, how to select the right one, and common pitfalls to avoid. Plus, read equipment advice from CPGs for ultimate cartoning success.
Read More
New ebook focused on cartoning equipment
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?