Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Headspace Analysis

PBI Dansensor offers the new CheckMate II for analyzing the headspace gas of O2, CO, and O2/CO2 in modified atmosphere packaging. A new sensor concept allows for extremely short measuring time, and sample volume is small and less dependent on headspace volume, thereby reducing sampling faults.

Pw 9918 P06p22c

Sturdy, user-friendly system may be set up with 500 different programs to sort and test data. New features include USB memory device and the ability to download via PC.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers