Explore all the latest packaging trends, all at PACK EXPO International
Discover new packaging and processing solutions from 2,500+ exhibitors, all under one roof at PACK EXPO International, Nov. 3 – 6 in Chicago.

Beckhoff Automation: High-precision bus terminal

The KL3356 analog input bus terminal from Beckhoff Automation provides a measurement accuracy of 0.01% for direct connection of resistor bridges, strain gauge sensors, and all common input signals.

Pw 12325 Beckhoff

It digitizes standard voltage and current signals with a resolution of 16 bits and precision of 15 bits. It self-calibrates every 3 minutes. Suitable for general-purpose monitoring and for controlling weighing, dosing, and similar operations.

New e-book on Multipacking and Case Packing
Read how to extend the life of your case packing equipment and best practices for efficient shrink bundling operation. Plus, learn the differences between wraparound & regular slotted containers.
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New e-book on Multipacking and Case Packing
Check out new technology from 2,500+ packaging & processing suppliers
PACK EXPO International is where you can discuss real-world problems with experts and land on innovative ideas. Discover every new packaging and processing trend, see machinery in action and learn sustainable solutions from experts.
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Check out new technology from 2,500+ packaging & processing suppliers