Kick off 2026 with a competitive edge at PACK EXPO East. Register now!
Get a jump on your 2026 goals at PACK EXPO East. Put projects in motion, accelerate timelines and solve challenges—all in one trip to Philadelphia.

Thermal-transfer overprinter

IID Technology’s COM II thermal-transfer overprinter has a 300-dpi print head that produces sharp, high-quality text, bar codes, logos, and data matrix codes.

Pw 5942 E Id Tech

Suited to high-speed production lines, the COM II is designed to integrate into a wide range of flexible packaging machines. Communicates with the printer using a PC with Web browser software, an existing OEM interface, or an optional, simple-to-use touchscreen. The COM II has easy, onboard label creation software and multiple message storage. Ribbon retraction feature minimizes the gap between prints, ensuring maximum efficiency of ribbon usage. Unit has a maximum print speed of 1,400mm/sec, uses 1,400-meter length ribbon and has a print area of up to 128 x 2,400 mm.

Phone: 888/438-3242 | www.idtechnology.com

Annual Outlook Report: Workforce
Hiring remains a major challenge in packaging, with 78% struggling to fill unskilled roles and 84% lacking experienced workers. As automation grows, companies must rethink hiring and training. Download the full report for key insights.
Download Now
Annual Outlook Report: Workforce
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.
Be the first to find what’s next in packaging & processing at PACK EXPO East. See new solutions from 500 exhibitors, uncover creative ideas for 40+ verticals and gain inspiration from free sessions on industry trends—all in one trip to Philadelphia.
REGISTER NOW & SAVE
Get a jump on your 2026 packaging & processing goals at PACK EXPO East.