Discover your next big idea at PACK EXPO Las Vegas
Experience a breakthrough in packaging & processing and transform your business with solutions from 2,300 suppliers spanning all industries. Click to learn more.

Hyde Park Electronics: Photoelectric sensors

Hyde Park Electronics LLC offers Telemecanique photoelectric and inductive proximity as part of its Osiconcept® sensor line. Osiris® photoelectric sensors feature “multimode” technology that allows a single product to perform functions found in as many as 5 different modes of sensors.

Pw 13085 Hyde Park Tile Sensor

Osiprox® inductive proximity sensors feature auto-adaptable technology that allows the sensor to be used in shielded or nonshielded environments and precise actuation point of the output via “fine-teach” mode.

Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
Annual Outlook Report: Automation & Robotics
Break out of the ordinary: see what’s new in packaging & processing!
At PACK EXPO Las Vegas, you’ll see machinery in action and new tech from 2,300 suppliers, collaborate with experts and explore transformative solutions. Join us this September to experience a breakthrough in packaging and processing.
REGISTER NOW AND SAVE
Break out of the ordinary: see what’s new in packaging & processing!