Meet the Future at PACK EXPO's NextGen Networking Fair

PACK EXPO International and Pharma EXPO 2016 Connect Packaging and Processing Employers with the Workforce of Tomorrow

The inaugural NextGen Networking Fair, a new event from PMMI, The Association for Packaging and Processing Technologies, offers a one-of-a-kind matchmaking opportunity for PACK EXPO International and Pharma EXPO 2016 exhibitors and attendees to connect with the emerging workforce.

Sponsored by B&R Industrial Automation, the event debuts on Sunday, Nov. 6, 2016 from 3:00 – 5:00 p.m. during PACK EXPO International and Pharma EXPO 2016 in the Education & Workforce Development Pavilion, in the North Mezzanine of McCormick Place. The fair provides employers in the processing and packaging industry, the opportunity to meet and connect with a targeted audience of talented students from packaging, processing, materials, package design and mechatronics programs.

“As the Baby Boomer generation reach retirement age, employers are looking for new talent to operate, maintain and design the packaging and processing technology needed to stay competitive,” says Patricia Anderson, education committee chair, PMMI. “With so many talented and skilled young people attending PACK EXPO International, this event is a perfect opportunity for processing and packaging employers to connect with these gifted students and guide them into careers in the processing and packaging field.”

Next Gen Networking Fair participants will also have the opportunity to learn about PMMI’s educational programs, such as eLearning, the Certified Trainer program, Mechatronics Certification Tests and more. Light refreshments will be served.

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