New Tool: ProSource
Checkout our packaging and processing solutions finder, ProSource.

The trend toward functional integration

At the recently held 1st Rexroth Global Technology Summit in Lohr, Germany, Stefan Reitmeier, manager of material and information flow technology at Bosch Rexroth, neatly demonstrated why the trend toward functional integration in machine building and line layout has the kind of momentum it has today.

Pw 12055 Reitmeier

In his presentation, Reitmeier showed the VE 2/AS-I, a pallet stop gate that might be found on a line dedicated to assembly, materials handling, or packaging. It consists of a single part. Its predecessor, the VE 2, consisted of 10 parts, including 3 inductive proximity switches, sensor brackets, sensor cables, valves and accessories, an AS-i bus interface, mounting plate and accessories, pneumatic installation materials, and label plates. By integrating all these functional parts into a single unit, Bosch Rexroth is now able to offer customers a single ordering number instead of 10. Installation is faster, too, when only one part is involved. Cost is about the same, Reitmeier told his audience, but simplicity gained is substantial.

Bosch Rexroth is hardly alone in taking advantage of this trend toward functional integration. Other technology providers and machinery makers serving the packaging space are doing the same. Reitmeier just happened to provide one of the nicest examples of a trend in action that this particular editor has seen lately.

How AI is reshaping CPG manufacturing operations
Today’s CPG companies are faced with mounting challenges in their manufacturing operations. You have the data that could help you, but can you turn that data into knowledge? See how artificial intelligence can help. Learn what’s working for Pfizer, Post, and Smithfield.
Read More
How AI is reshaping CPG manufacturing operations
How Can You Honor a Leader?
Induction into the Packaging & Processing Hall of Fame is the highest honor in our industry. Submit your leader to be considered for the Class of 2024 now through June 10th. New members will be inducted at PACK EXPO International in Chicago
Read More
How Can You Honor a Leader?