—Barry-Wehmiller Co., Inc. (St. Louis, MO) has acquired the assets of the Label Equipment Group (Los Angeles, CA) of CCL Industries. and —MWS (Milwaukee, WI). Paperloop.com (San Francisco, CA) has finalized the acquisition of Resource Information Systems, Inc. (Bedford, MA). —The Mead Corp. (Dayton, OH) has completed the acquisition of the carbonless coating operations of Moore Corp. Ltd. (Toronto, Ontario, Canada). —An investor group, lead by B. Joseph Rokus, the former owner of Reid Plastics, Inc., has acquired Berkley Industries, LLC (La Mirada, CA). —Tuscarora (New Brighton, PA) has agreed in principle to acquire Technapack, Inc. (Hillsboro, OR). —HK Systems, Inc. (Milwaukee, WI) and Rensselaer Polytechnic Institute (Troy, NY) have partnered to develop new technology for the material handling industry.
Domestic acquisitions, agreements
GE Fanuc Automation (Charlottesville, VA) and Phoenix Contact (Harrisburg, PA) have made an agreement where GE Fanuc will employ Phoenix Contacts low-density I/O product, Inline, as the foundation for its own I/O product, VersaPoint.
Jan 31, 2001
Companies in this article
Machinery Basics
Annual Outlook Report: Sustainability
The road ahead for CPGs in 2025 and beyond—Packaging World editors review key findings from a survey of 88 brand owners, CPG, and FMCG readers.
Download Now
Annual Outlook Report: Automation & Robotics
What's in store for CPGs in 2025 and beyond? Packaging World editors explore the survey responses from 118 brand owners, CPG, and FMCG Packaging World readers for its new Annual Outlook Report.
Download
























