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Domestic acquisitions, agreements

GE Fanuc Automation (Charlottesville, VA) and Phoenix Contact (Harrisburg, PA) have made an agreement where GE Fanuc will employ Phoenix Contact’s low-density I/O product, Inline, as the foundation for its own I/O product, VersaPoint™.

—Barry-Wehmiller Co., Inc. (St. Louis, MO) has acquired the assets of the Label Equipment Group (Los Angeles, CA) of CCL Industries. and —MWS (Milwaukee, WI). Paperloop.com (San Francisco, CA) has finalized the acquisition of Resource Information Systems, Inc. (Bedford, MA). —The Mead Corp. (Dayton, OH) has completed the acquisition of the carbonless coating operations of Moore Corp. Ltd. (Toronto, Ontario, Canada). —An investor group, lead by B. Joseph Rokus, the former owner of Reid Plastics, Inc., has acquired Berkley Industries, LLC (La Mirada, CA). —Tuscarora (New Brighton, PA) has agreed in principle to acquire Technapack, Inc. (Hillsboro, OR). —HK Systems, Inc. (Milwaukee, WI) and Rensselaer Polytechnic Institute (Troy, NY) have partnered to develop new technology for the material handling industry.

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Discover solutions from 2,000+ exhibitors to advance your operations and network with colleagues at PACK EXPO International, Oct 23-26.
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Where the Entire Industry Meets
The top conveying tips
Read best practices to ensure efficient product handling.
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The top conveying tips