Packaging World Editor Pat Reynolds to explore trends

What does the future hold for packaging, what’s on the drawing board, and where will the next advances occur?


Packaging World Editor Pat Reynolds will explore these issues, bringing his insights on topics ranging from digital printing to in-pack microwave pasteurization, as he presents “What’s Coming Down the Packaging Pike” at Pack Expo Las Vegas, Sept. 26-28.

Reynolds’ presentation, scheduled for Sept. 28, is part of the Institute of Packaging Professionals’ Learning Center Conference. In all, the IoPP conference will offer 19 sessions throughout Pack Expo. View the complete conference agenda.

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